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Product Overview
ALPHA NCP-LR002 is a lead-free, no-clean solder paste designed for applications where high soldering activity, low voiding and very low flux residues are desired.
This product is designed to enable consistent fine pitch printing capability and almost “zero” residue cosmetic appearance after reflow. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.
Features
- Almost “no residue” cosmetic appearance
- Excellent voiding performance
- Excellent print consistency with high process capability index across all board designs
- Wide reflow profile window with good solderability on various board
ALPHA NCP-LR002 is a no-clean low residue solder paste designed for a broad range of applications.
Technical Data Sheet
ALPHA NCP-LR002 Solder Paste TDS English
ALPHA NCP-LR002
|
Product Name |
Paste Type |
Alloy Type |
Feature Capability |
Paste Component Type |
|---|---|---|---|---|
|
ALPHA NCP-LR002 |
No clean |
Lead-Free |
Standard Pitch |
SiP |
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