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Product Overview
ALPHA WS-699CPS is a next generation water soluble solder paste specifically designed for fine pitch and high-density applications. ALPHA WS-699CPS broad processing window is designed for stencil printing for either surface mount or solder bumping processes.
ALPHA WS-699CPS is formulated to deliver an outstanding reflow process window with fine powder sizes such as Type 6 and 7 with excellent low voiding performance. It delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent slump resistance performance for fine pitch printing.
Features
- Low voiding performance
- Maximizes reflow yield for lead-free processing
- Excellent print consistency with high process capability index
- Reduction in random solder balling levels, minimizing rework and increasing first time yield
ALPHA WS-699CPS is a next generation water soluble solder paste specifically designed for fine pitch and high density applications.
ALPHA WS-699CPS Solder Paste TDS English
ALPHA WS-699CPS
|
Product Name |
Paste Type |
Alloy Type |
Feature Capability |
Paste Component Type |
|---|---|---|---|---|
|
ALPHA WS-699CPS |
Water soluble |
Lead-Free |
Standard Pitch |
SiP |
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