MacDermid Alpha Electronics Solutions Launches Advanced Via Fill Chemistry Boosting Reliability for Next-Generation High-Density Interconnects

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to introduce MacuSpec VF-TH 500. This high-performance via filling and simultaneous through hole acid copper electroplating process is designed to enable increased reliability of complex, High Density Interconnect (HDI) Printed Circuit Boards (PCBs) for next-generation technologies.

Meeting Industry Demands
 

The growth in high-performance servers for AI applications, advanced automotive systems, and high-speed networking infrastructure is driving the demand for more complex, multilayer boards that must meet stringent reliability and performance requirements. MacuSpec VF-TH 500, the latest innovation in MacDermid Alpha’s award-winning MacuSpec VF-TH series, provides fabricators and OEMs with a versatile solution to meet these requirements.

Enhanced Performance and Versatility
 

MacuSpec VF-TH 500 is designed for HDI boards that require simultaneous via filling and through hole plating with excellent microdistribution for panel plating and modified Semi-Additive Processing (mSAP) pattern plating. The chemistry provides high via filling performance for via sizes up to 200 x 100 µm. Fabricators can expect a reliable deposit and improved throwing power at the knee and through hole.

MacuSpec VF-TH 500 enables more complex board designs in applications such as MSAP, high-reliability automotive, and high-performance computing. 

Expert Insights
 

“To meet the reliability and performance requirements for high-density interconnects, fabricators are often faced with challenges associated with large vias and complex via structures”, comments Dr. Kesheng Feng, Director of Metallization Research at MacDermid Alpha.  

“MacuSpec VF-TH 500 delivers outstanding results for mSAP with minimal copper addition to the surface. This enhances line/space reduction, boosts circuit density, and improves signal transmission. The process is highly versatile, meeting the needs of advanced fabricators.”

Key Benefits for Fabricators
 

MacuSpec VF-TH 500 offers fabricators the following process benefits:

• Panel, pattern, or button plating capability.  
• Compatible with VCP or vertical hoist equipment.
• Flexible options for both insoluble and soluble anode systems.  
• Works seamlessly with direct metallization or electroless copper, ensuring reliable microvias with epitaxial growth across the interface.  

Discover More
 

Discover how our latest via fill chemistry can benefit your advanced interconnect applications. For more information reach out to a member of our team