News & Events

MacdermidAlpha-Market
EV Charge
Assembly, Semiconductor
Press Release
MacDermid Alpha Unveils Next-Generation Solder & Sinter Solutions at productronica China 2025
According to Statista, the electronic products and components market will reach a value-added output of $1.5 trillion this year. Along with this growth, the electronics demand for innovative materials that enhance performance, and reliability has never been greater. At productronica China 2025 (March 26 to 28, Hall E4, booth #4700), MacDermid Alpha Electronics Solutions will showcase breakthrough materials engineered to meet these challenges - delivering superior thermal management, interconnect reliability, and process efficiency for next-generation electronic applications.
IPC APEX
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions to Showcase New Innovations and Industry Expertise at IPC APEX EXPO 2025
MacDermid Alpha Electronics Solutions a leading innovator of integrated materials and solutions in the electronics industry, will be attending the highly anticipated IPC APEX EXPO, taking place March 18 to 20 at the Anaheim Convention Center, California. The company will be showcasing its latest groundbreaking product, ALPHA® HiTech® CF31-4026, a new reworkable edgebond designed to address key challenges in the electronics industry, alongside a series of insightful discussions by four of their esteemed industry experts.
macdermid_alpha-henkel-heraeus
Assembly, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions, Heraeus Electronics, and Henkel Win Patent Dispute Against Senju Group
Alpha Assembly Solutions (a legal entity of MacDermid Alpha Electronics Solutions), Heraeus Electronics, and Henkel have successfully concluded the patent dispute against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) relating to the infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material. In the dispute, Alpha Assembly Solutions, Heraeus, and Henkel succeeded in both patent infringement proceedings and related patent nullity proceedings.
Primary met 8
Circuitry
Press Release
MacDermid Alpha Electronics Solutions Launches Shadow® Plus: Advanced Direct Metallization Technology for Cutting-Edge, High-Density Applications
(Waterbury, CT USA) – February 6, 2025 - MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is delighted to introduce Shadow® Plus. This ultra-stable, graphite-based direct metallization technology addresses the automotive and electronics industries’ need for increased functionality and reliability of electronic devices with higher density, and advanced circuit designs.
edgebond
Assembly, Semiconductor
Press Release
Redefining Reliability and Sustainability in High-Temperature Applications with ALPHA® HiTech® CF31-4026
EV
Assembly, Semiconductor
Multimedia
Enhancing Safety, Reliability, and Efficiency of Onboard Chargers with Integrated Electronic Assembly Solutions
The onboard charger (OBC) is a vital component of an electric vehicle (EV), enabling the safe and efficient conversion of AC power from charging stations to the DC power required to recharge the battery. Beyond power conversion, the OBC acts as a critical hub for communication and control, interfacing with the vehicle’s controller and the charging station. By monitoring and optimizing charging parameters like voltage and current, the OBC ensures the battery is protected from risks such as overcharging, overheating and other electrical faults, thereby contributing to the safety and longevity of the EV.
Using Reliance
Assembly, Semiconductor
Announcements
A New Path to Board-Level Reliability
We are delighted to announce our latest article featured in GlobalSpec has been published.
In this piece, we share our innovative solution to board-level reliability, particularly challenging in industries such as automotive and high-performance computing.
Car
Assembly, Semiconductor
Multimedia
Future Trends of Power Electronics in the EV Market
Revolutionizing High-Performance Power Electronics with Innovative Materials and Manufacturing Processes
EV Bike
Assembly, Semiconductor
Multimedia
Enhancing Safety and Performance of Small EV Motors With Thermally Conductive Potting Compounds
In this paper, we highlight the importance of thermal management in electric vehicle (EV) motors. Focusing on the EV motor market for two-wheeled vehicles, we explore how thermally conductive potting compounds are employed to significantly reduce their operating temperature. This enhances performance and extends the life of EV motors.
Semi con wafer
Circuitry
Press Release
Transformative Next-generation Acid Copper Electroplating Process Enables High Performance and Enhanced Reliability for Advanced Packages
MacDermid Alpha Electronics Solutions Launches MICROFAB® SC-40 PLUS to meet the latest advancements in semiconductor manufacturing.
hard
Film and Smart Surface Solutions
Press Release
MacDermid Alpha Showcases New Formable Films for Smart Controls and Surfaces at EACC Future Cockpit Conference & Trade Show 2024
MacDermid Alpha, a global leader in integrated solutions for the electronics and automotive industries, is proud to participate in the EACC 2024 Future Cockpit Conference & Trade Show at Booth D038. The trade show is scheduled to take place on June 21-22 at the Suzhou International Expo Centre, in China.
Clarke Dai Article
Assembly, Semiconductor
Multimedia
Clark Dai - Meet an Expert from the Electric Vehicle Industry
Read this Q&A article with Clark Dai, one of our EV Technology market managers, as he explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry.
ENIG Webinar
United States
Live Webinar - Review of the Latest ENIG IPC-4552 Specification and How it can Help in Quality Disputes
Webinar/Online
Circuitry
Join Dr. Frank Xu, Global Product Manager - Final Finishes, as he reviews the most recent corrosion update in IPC ENIG specification upgrades and discusses how recent changes will affect PCB fabricators.
APEC 2025
United States
Visit MacDermid Alpha Electronics Solutions at APEC 2025
Conference
Assembly, Semiconductor
Visit us at booth 314 at the 40th Anniversary of the Applied Power Electronics Conference (APEC) 2025, a leading event dedicated to the practical and applied aspects of power electronics.
PCIM EU 2025
Germany
Visit MacDermid Alpha Electronics Solutions at the PCIM Expo & Conference – Europe 2025
Trade Show
Assembly, Semiconductor
Visit us at PCIM Europe 2025, Booth 460, Hall 7! Discover our advanced bond pad and sintering solutions for power electronics. See live demos and learn how we’re driving innovation!
IPC APEX EXPO 2025
United States
Visit MacDermid Alpha Electronics Solutions at the IPC APEX EXPO 2025
Trade Show
Assembly, Semiconductor
Visit our experts and discover how our integrated solutions are shaping the future of the electronics industry. From advanced assembly materials to high-reliability conformal coatings and potting compounds, we deliver end-to-end solutions for every step of your manufacturing process. Join us at Booth #1042 to learn more!
Productronica China 2025
China
Productronica China 2025
Trade Show
Assembly, Semiconductor
As the electronics industry pushes the boundaries of miniaturization, high-power density, and extreme reliability, manufacturers face mounting challenges in thermal management and assembly durability. At Productronica China 2025 (March 26–28, Booth 4700 in Hall E4), MacDermid Alpha Electronics Solutions will introduce breakthrough solutions designed to redefine performance standards in semiconductor packaging and circuit board assembly.
CPCA
China
CPCA 2025
Trade Show
Circuitry
Discover our next-generation Circuitry Solutions for high-performance interconnects at the CPCA Show. Visit our experts at hall 8.1 booth #8B10 to learn how we are driving innovation in high-reliability circuit board fabrication, delivering cutting-edge direct metallization, advanced plating, and interconnect solutions to address today’s industry challenges.
ISPEC 2025
India
ISPEC 2025
Conference
Assembly, Semiconductor
MacDermid Alpha Electronics Solutions will be exhibiting at ISPEC 2025, taking place March 5-7 in Gandhinagar, India in booth 81-83. As a global leader in electronic materials, we are committed to driving innovation in power electronics, semiconductor packaging, and advanced interconnect solutions.
imaps 2025
United States
IMAPS 21st Annual Device Packaging Conference (DPC) 2025
Trade Show
Circuitry, Semiconductor
Discover how to transform your next-generation package performance with our advanced interconnect metallization and semiconductor assembly solutions at the IMAPS 21st Annual Device Packaging Conference. Meet our technology experts in booth #503 to learn how to unlock tomorrow’s semiconductor potential with cutting-edge solutions.
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