News & Events

MacdermidAlpha-Market
ADAS Chapter 3
Assembly, Semiconductor
Multimedia
Autonomust-feelings: Why Emotions Are Driving Autonomous Vehicle Brand Perception
Read this article by Lenora Clark, Director, Technology Marketing and ADAS on Why Emotions Are Driving Autonomous Vehicle Brand Perception
wafer-level_packaging
Assembly, Semiconductor
Press Release
Next-generation Tin Silver Bump Metallization Process improves precision, reliability, and performance.
MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry.
Teng Long
Assembly, Semiconductor
Multimedia
The EV Industry: China vs Rest of World - China's Distinct Culture and Technological Advancements in the Global EV Landscape
Q&A with Professor Teng Long, professor of power electronics at the University of Cambridge, UK.
EV India 3
Assembly, Semiconductor
Multimedia
“Drive Further” – Integrated circuit board assembly solutions for the fast-paced electric vehicle industry in India
With tech startups emerging to support the industry across the country, India’s electric vehicle (EV) market is developing at a record pace. This progress is not only transforming the transportation sector but also influencing daily life and the country’s economy.
DM article 3
Circuitry
Multimedia
Addressing PCB Environmental Supply Chain Issues with Direct Metallization Technologies
Supply chain management plays a crucial role in meeting the demand for printed circuit boards (PCBs) in today’s global electronics marketplace. Many complex logistical issues must be considered when developing a robust supply chain strategy. From labor costs and lead times to geopolitical tensions and environmental impacts, the challenges are numerous.
Julien
Assembly, Semiconductor
Multimedia
Meet the Pioneers of Silver Sintering Technology for the Automotive Industry
Q&A with MacDermid Alpha’s Line of Business Director for Power Electronics, Julien Joguet, and Global Director of Strategic Accounts, Steve Brown
ALPHA SF828-MBB
Assembly
Press Release
MacDermid Alpha launches ALPHA® SF828-MBB photovoltaic liquid flux for advanced multi-busbar interconnections
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha’s latest liquid flux for the photovoltaic market.
Shield
Assembly
Press Release
MacDermid Alpha Electronics Solutions Launches a New Packaging Authentication Process
The new anti-counterfeit labeling process is designed to protect its customers by ensuring product authenticity and delivering the highest product quality and sustainability.
chip
Circuitry
Multimedia
Revolutionizing Profitability through Advanced Direct Metallization Technology
Leveraging change as a catalyst to enhance profitability in the printed circuit board (PCB) fabrication industry is both a strategic imperative and a promising opportunity. In an era of rapid technological evolution and shifting market dynamics, embracing change is not just a choice; it is a necessity. By continually adapting to new manufacturing technologies, materials, and design methodologies, PCB fabrication companies not only stay competitive but also drive increased profitability.
ALPHA OM-362
Assembly
Press Release
MacDermid Alpha Launches Next-gen Low-void Solder Paste ALPHA® OM-362
Improve board level reliability by reducing solder joint voiding below 10%

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.
green-ecofriendly-circuits-processor
Circuitry
Multimedia
Green Electronics - Environmentally Responsible Alternatives to Traditional PCB Fabrication
Traditional PCB fabrication leaves a toxic legacy in its wake, but a revolution is underway. There are eco-friendly alternatives reshaping the electronics industry and paving the way for a cleaner, greener future.
Low oxide etch
Circuitry
Multimedia
Achieving Optimal Signal Integrity with Low and No Roughness Adhesion Promoters
In the manufacture of advanced electronics, high-speed signal requirements are becoming common. As a result, printed circuit board (PCB) manufacturers, IC Substrate fabricators, and original equipment manufacturers (OEMs) are looking for solutions to enable them to build and design circuit boards that transmit at higher signal speeds than previously possible with standard manufacturing processes.
What do you need solved?
Let our experts find your solution.