News & Events

MacdermidAlpha-Market
Semi con wafer
Circuitry
Press Release
Transformative Next-generation Acid Copper Electroplating Process Enables High Performance and Enhanced Reliability for Advanced Packages
MacDermid Alpha Electronics Solutions Launches MICROFAB® SC-40 PLUS to meet the latest advancements in semiconductor manufacturing.
hard
Film and Smart Surface Solutions
Press Release
MacDermid Alpha Showcases New Formable Films for Smart Controls and Surfaces at EACC Future Cockpit Conference & Trade Show 2024
MacDermid Alpha, a global leader in integrated solutions for the electronics and automotive industries, is proud to participate in the EACC 2024 Future Cockpit Conference & Trade Show at Booth D038. The trade show is scheduled to take place on June 21-22 at the Suzhou International Expo Centre, in China.
Clarke Dai Article
Assembly, Semiconductor
Multimedia
Clark Dai - Meet an Expert from the Electric Vehicle Industry
Read this Q&A article with Clark Dai, one of our EV Technology market managers, as he explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry.
Vehicle Safety
Circuitry
Multimedia
The Importance of High-Quality Materials in Vehicle Safety Hardware
We are on the cusp of a major breakthrough within the world of automotive. Among the changes that are set to redefine every facet of mobility are developments such as electrification and autonomous driving.
lab
Circuitry
Press Release
MacDermid Alpha Electronics Solutions and Meiko Electronics Co., Ltd. Announce Direct Metallization Installation for Rigid PCBs
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry is honored to support Meiko Electronics Co., Ltd. on their first installation of the carbon-based direct metallization technology for rigid PCB applications in Japan.
Direct Metallization Webinar - Unlocking a Sustainability Win in PCB Fabrication
Circuitry
Multimedia
Direct Metallization Webinar - Unlocking a Sustainability Win in Printed Circuit Board Fabrication Using Less Power, Water and Chemicals
William Yu
Assembly, Semiconductor
News
Best Paper Award at SMTA China East Technology Conference
William Yu, our business development manager, won the Best Paper Award at the 2024 SMTA China East Technology Conference for the technical paper: Next-generation High-reliability Solder for Enabling Enhanced Thermo-mechanical Performance in Automotive Applications.
Maurizio
Multimedia
Meet an expert from the Electric Vehicle Industry
Q&A with MacDermid Alpha’s Director of R&D Applications
Innolot MXE Yellow
Assembly, Semiconductor
Press Release
Empowering Electronics Assembly: Introducing ALPHA® Innolot® MXE Alloy
In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.
ADAS Ch 3
Assembly, Semiconductor
Multimedia
Advanced Driver Assistance Systems (ADAS): It’s Not What, It’s How
Read this article by Rainer Venz, on ADAS: It’s not what, it’s how...
Patent infringement PR - Logos
Assembly, Circuitry, Film and Smart Surface Solutions, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Electronics Solutions, Heraeus Electronics, and Henkel Win Patent Infringement Lawsuit Against Senju Group
Alpha Assembly Solutions (MacDermid Alpha), Heraeus, and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH, and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.
cooling board
Assembly, Semiconductor
Multimedia
Eliminating Hotspots On Printed Circuit Boards
With the continued miniaturization of automotive electronics, PCB (Printed Circuit Board) designers must consider the thermal demands in these smaller assemblies. This is especially true in PCBs that operate at high current-carrying capacity, as the increases in heat can lead to “hotspots”. In turn, these hotspots can cause warped, blistered, or even burnt boards, leading to premature component failure.
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