News & Events

(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.

The Assembly Division of MacDermid Alpha Electronics Solutions is excited to announce a new distribution partnership with Deery Brook for the sale and distribution of Alpha brand products in Hungary, effective March 16th, 2021.

MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

The Assembly Division announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions is pleased to launch ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

In line with the latest REACH Annex XIV regulations banning the use of Nonylphenol Ethoxylate (NPE) and Octylphenol Ethoxylate (OPE) based surfactants due to come into effect in Europe on the 4th January 2021, MacDermid Alpha is ready to offer customers soldering products that ensure compliance to the regulation.

MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

MacDermid Alpha Electronics Solutions will be hosting a series of free webinars covering the basics of building a printed circuit board. The series will begin Tuesday, October 27, 2020 1:00 – 3:00pm EST and will run every Tuesday until November 17.

MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.

MacDermid Alpha Electronics Solutions announces the release of Systek UVF 100, the newest release in the Systek family of IC Substrate manufacturing solutions.