News & Events

MacdermidAlpha-Market
SMTA Event Banner
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions to Present Latest Research at SMTA International 2021
MacDermid Alpha Electronics Solutions will exhibit its latest interconnect solutions and present nine papers at the SMTA International Expo and Conference taking place November 1 - 4 at the Minneapolis Convention Center in Minneapolis, MN.
Lenz SP
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions Celebrates 25 Years of Partnership with Distributor Lenz SP.j
The Assembly Division of MacDermid Alpha Electronics Solutions has celebrated 25 years of partnership with Lenz SP.j, its distributor of ALPHA brand products in Poland.
News_Microfab EVF NiBar_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel
MacDermid Alpha Electronics Solutions and electronics assembly announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
Blue and orange HK Wentworth Group logo
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Electronics Solutions Announces the Acquisition of H. K. Wentworth Group
MacDermid Alpha Electronics Solutions, a leading global supplier of specialty chemicals and materials used in the semiconductor fabrication, semiconductor packaging, and printed circuit board fabrication and assembly markets announced today that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands.
Three photos of new MacDermid Alpha Applications Lab in Taiwan, one of the building and two inside the lab
Semiconductor
Press Release
New Die Attach Applications Center Opens in Zhongli District, Taoyuan City, Taiwan R.O.C
(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.
News_STAYDRY H2-3000PSA_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - STAYDRY® H2-3000PSA: Hydrogen & Moisture Getter Film
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.
News_SMT Global Packaging Panel_2Sep2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Technology Experts to Participate in Online Industry Panel Discussions
MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).
MAES
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Announces the Appointment of Rick Fricke as Vice President and General Manager of Semiconductor Solutions Division
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.
STAYDRY Z20
Semiconductor
Press Release
Product Launch - STAYDRY® Z20: Moisture Getter Film
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® Z20 – Moisture Getter for hermetic packages. STAYDRY Z20 is a silicone film moisture getter with a newly developed proprietary backing adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting MIL-STD-883K, Method 5011.6.
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