Technology Experts to Participate in Online Industry Panel Discussions

Mike Murphy, Director, Marketing – Core Products for the Assembly Division of MacDermid Alpha will take part in the panel discussion Recent Advances in Low Temperature Solders, hosted by Global SMT & Packaging at 10:45am EST.

The discussion will focus on the recent developments in low temperature solder technology and the benefits of using low temperature solders in a range of assembly applications. Jason Fullerton, Customer Technical Support Engineer will participate in the SMT Printing Roundtable discussion webinar hosted by SMTA at 4.30pm EST. The roundtable will discuss common printing challenges and will cover a range of topics including solutions for solder volume issues, high tension stencils, nano-coatings and pin-and-paste.