News & Events

MacDermid Alpha Electronics Solutions and electronics assembly announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.

MacDermid Alpha Electronics Solutions, a leading global supplier of specialty chemicals and materials used in the semiconductor fabrication, semiconductor packaging, and printed circuit board fabrication and assembly markets announced today that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands.

(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® Z20 – Moisture Getter for hermetic packages. STAYDRY Z20 is a silicone film moisture getter with a newly developed proprietary backing adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting MIL-STD-883K, Method 5011.6.