Organic Solderability Preservative

ENTEK PLUS HT exhibits consistent and extremely low resistance, even after three lead-free reflows. Conversely, the competitor’s OSP offers unpredictable and significantly higher resistance as witnessed by the variable, wide ranges documented. The variability progressively worsens as more force is applied by the probe.

ENTEK PLUS HT superior ICT capability substantially reduces rejects and rework, resulting in higher assembly yields. Black market processes claiming to offer the performance of an OSP do not compare!

Tests performed using ALPHA lead-free, no-clean solder pastes with SAC 305 solder spheres demonstrate that ENTEK PLUS HT has better ball shear strength properties and superior cohesion compared with competitive OSPs. Less standard deviation results in more consistent solder joint strength and solderability.

As shown, ENTEK PLUS HT clearly provides a more aesthetically pleasing finish that maintains exceptional solderability through multiple high temperature processing versus a competitive, latest generation OSP. A comparison between black market processes that claim to be OSPs provide even more inferior results.

ENTEK PLUS HT exhibits unmatched solder spread performance compared with a well known competitive OSP.

As the inter-stripe pad spacing (mm) increases, ENTEK PLUS HT clearly demonstrates its superior wetting capability by as much as 60%. Even at narrower pad spacing, ENTEK PLUS HT delivers a minimum of 25% better spread.

ENTEK PLUS HT has demonstrated over a 50% better hole fill performance versus competitive OSPs in lead-free soldering.

Given this astonishing data, you can truly appreciate the even more dramatic improvements and increased yields ENTEK PLUS HT can deliver versus black market OSPs!

ENTEK PLUS HT consistently demonstrates superior wetting balance test results, even after three lead-free reflows at 260°C compared with the competitive OSP.

Wetting performance testing was undertaken using a no-clean flux with an industry leading SAC 305 lead-free solder at 260°C. ENTEK PLUS HT clearly demonstrates much faster wetting with a substantially higher maximum force (mN/mm). These are key indicators of excellent copper protection and solderability versus the competitor and other black market OSPs.

The patented process inhibits galvanic etch effects, resulting in enhanced PCB reliability.

ENTEK Cleaner removes trace contaminates while wetting small pad features.

ENTEK Microetch further enhances the surface topography and provides fresh, active copper surfaces for subsequent process steps.

ENTEK PLUS HT includes a pre-coat and coating process that improves stability, extends bath life and reduces required maintenance. ENTEK Precoat prepares the surface for a more stable, reliable coating.