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High-speed signals, faster processing, and improved performance are delivered by our suite of 5G circuitry solutions.
Fine Line Resolution
Our copper plating solutions deliver leading edge electronic technologies that require finer line and space resolution.
High Layer Count
Our copper interconnects are at the heart of the extremely high layer count boards that power cloud computing.
The HDI revolution in electronics was enabled by microvia structures. Our solutions make it more reliable for expanded usage.
Our product selection for modified Semi-Additive Process for high density circuitry is enabling higher yields and new designs.
High frequency electronics are becoming widely deployed and our solutions allow for improvements in signal integrity.