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Addressing PCB Reliability, High-Density Designs, and Sustainability at the JPCA Show
Proven Reliability for Cutting Edge Substrates
Albert Tseng, Product Manager for Metallization at MacDermid Alpha, will introduce MacDermid Alpha’s latest direct metallization technology in the presentation ‘A High Conductivity, Low Etch Amount and Highly Sustainable Direct Metallization Process -Shadow Plus’ on June 13th at 10:30 am.
Shadow Plus is MacDermid Alpha’s fastest throughput and most reliable alternative to electroless copper in the primary metallization step of PCB manufacturing. It can handle the most demanding designs used in critical applications such as advanced automotive and artificial intelligence. Shadow Plus enhances reliability through direct copper-to-copper bonding with fewer interfaces and no chance of nano-voiding, while delivering substantial sustainability benefits. Utilizing fewer process and rinse steps, and running at lower operating temperatures, Shadow Plus delivers a large reduction in waste generation and water and power consumption.
Enabling Challenging High-Density Designs
Fabricators of IC substrates require the capability to deliver interconnect densities far beyond that of the typical printed circuit board fabricator. Our Systek™ line of IC substrate chemicals provide the solutions for the most technically challenging high-density designs. The Systek family of high-performance build-up processes for IC Substrates and their integrated lead frame package portfolio span the entire process of building QFN packages from lead frame roughening and improving sidewall solderability for enhanced reliability to selective EMC plating for higher functionality.
The JPCA (Japan Electronics Packaging and Circuits Association) Show is one of the largest exhibitions for the printed circuit board industry in Japan, encompassing all product and technology areas in electronic circuit production, development, and research.