CPCA 2025

Join us at the CPCA Show where we will showcase our portfolio of chemistries that enable superior via reliability, fine-line processing, and high-density interconnect (HDI) performance. As the demand for miniaturization, 5G, high-frequency substrates, and next-gen computing grows, our integrated approach ensures faster processing, improved adhesion, and sustainable metallization, meeting the needs of today’s high-reliability PCB, IC substrate, and flexible circuit manufacturing.

Explore Our Cutting-edge Solutions for Advanced Interconnects:

MacuSpec™ VF-TH 500: The latest innovation in the award-winning VF-TH series enables high performance via-filling and through-hole plating, offering excellent results for large, deep microvia filling.

Shadow^® Plus: Our most advanced graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.

Systek™ IC Substrate Solutions: Our Systek™ line of IC substrate chemicals provide solutions for the most technically challenging high-density designs. MacDermid Alpha has solutions for every step of the IC substrate fabrication process from innerlayer bonding and electrolytic copper plating to final finishes.

Don’t Miss Our Presentations!

Presentation Title: Advancing Via Fill Plating Process and Via Reliability
Speaker: Kesheng Feng, R&D Director, Metallization

Presentation Title: A New Flex Electroless Nickel Chemistry for ENIG and ENEPIG Applications
Speaker: Kenny Lin, Product Specialist

Connect with our experts in Hall 8.1 booth #8B10 to discover how our innovative and sustainable solutions enable the latest technologies for a wide range of markets in the rapidly changing electronics industry.

Register Here