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HKPCA Show
We invite you to join us at the HKPCA Show where we will showcase our chemistries that meet reliability and performance goals to address today’s industry challenges including increased design complexity and miniaturization. Our technical experts will be on hand to discuss how our innovative and sustainable solutions enable the latest technologies for a wide range of markets in the rapidly changing electronics industry.
Learn More About Our Featured Solutions:
Shadow® Plus: Our most advanced graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.
Systek™ IC Substrate Solutions: Our Systek™ line of IC substrate chemicals provide solutions for the most technically challenging high-density designs. MacDermid Alpha has solutions for every step of the IC substrate fabrication process from innerlayer bonding and electrolytic copper plating to final finishes.
Affinity™ ENIG/ENEPIG Final Finishes: Our hybrid gold technologies for ENIG/ENEPIG final finishes provide high reliability, corrosion elimination and significant cost of ownership improvements.
M-Speed HF: This low-etch oxide alternative coating provides low surface profiles and reliable adhesion for high frequency applications. M-Speed HF creates an exceptional surface topography on all three exposed sides of the copper trance to ensure electrical properties meet the needs of high frequency designs.
Don’t Miss Our Presentations!
Our team will present two presentations during the technical conference:
Increase Performance in Flexible Circuits
Presentation: A New Flex Electroless Nickel Chemistry for ENIG and ENEPIG Applications
Speaker: Ryan Tam, Business Director – Technical Business Development Director
Date/Time: Wednesday 4th December – 13:30-14:00
Enhance Reliability in High-Density Boards
Presentation: Interaction and Optimization of Direct Metallization and Copper Plating Steps
Speaker: Albert Tseng – Product Manager – Metallization
Date/Time: Thursday 5th December – 15:30 – 16:00
Register Here