IMAPS 21st Annual Device Packaging Conference (DPC) 2025

Enhanced Electrical and Thermal Performance

Hybrid bonding has emerged as a promising technique for assembling next-generation packages. Our experts will present two papers on this emerging technology during the WP1: Heterogeneous 2D & 3D Integration Track – Hybrid Bonding session on March 5^th.

Paper Title: Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding
Speaker: Jianwen Han, Principal Research Scientist
Time: 14:00-14:30

Paper Title: Electrochemical Plating of Metastable Fine Grain Cu for Cu-Cu Hybrid Bonding Applications
Speaker: Thomas Richardson, Senior R&D Manager
Time: 14:30-15:00

High Reliability for Advanced Applications

Discover innovative processes that enable increased reliability for advanced next-generation applications in our two papers that will be presented during the WP2: Fan-Out, Wafer Level & Flip Chip Packaging Track – Process and Materials session on March 5^th.

Paper Title: Copper Electroplating Process for mSAP in the Era of AI and HPC
Speaker: Saminda Dharmarathna, R&D Line of Business Partner – IC Substrates
Time: 13:30-14:00

Paper Title: NiFe and CoRe Alternative Solder Diffusion Barrier
Speaker: Elie Najjar, Senior Director – R&D – Wafer Level Packaging
Time: 14:00-14:30

Leading-Edge, Advanced Packaging Solutions

Discover our portfolio of integrated solutions designed to elevate the performance and reliability of cutting-edge technologies. Visit our experts at booth #503 to learn about our complete portfolio of wafer fabrication, IC substrate and semiconductor assembly solutions including:

• Low Alpha Tin Materials - Our Low Alpha Tin portfolio offers the ultimate solution for eliminating alpha particle emissions in critical semiconductor applications. With a vertically integrated supply chain, we ensure high purity and sustainable sourcing.
• Systek™ - Our Systek™ line of IC substrate chemicals provide solutions for the most technically challenging high-density designs.
• Getters – Our getter products are well-suited for complex hermetic packages because they effectively manage and maintain the ultra-low moisture and gas levels required for long-term reliability.

The IMAPS 21st Annual Device Packaging Conference (DPC 2025) is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The 2025 conference will feature technical sessions on heterogeneous 2D and 3D integration, emerging technologies, fan-out, wafer, panel level and flip chip packaging, as well as professional development courses, an interactive poster session, and more.

Register Here: https://imaps.org/page/IMAPSDevicePackaging2025