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TPCA Show and IMPACT – International Microsystems, Packaging, Assembly and Circuits Technology Conference
Meet our technical experts at our booth to learn how our range of high reliability, and high-performance solutions combined with our deep expertise throughout the electronics supply chain make MacDermid Alpha the solutions supplier of choice for PCB and IC Substrate manufacturers.
Product Highlights
Introducing Shadow Plus Advanced Direct Metallization Technology.
Our most reliable graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.
Showcasing IC Substrates Solutions for Challenging High-Density Designs.
Our Systek™ line of IC substrate chemicals provide solutions for the most technically challenging high-density designs. MacDermid Alpha has solutions for every step of the IC substrate fabrication process from innerlayer bonding and electrolytic copper plating to final finishes.
Unveiling Our Solutions that Empower Future Technologies.
Our range of metallization solutions for advanced RDL via fill and fine line plating, and our conformal copper plating solutions that deliver ultra-high uniformity for high area ratio applications are empowering AI future technologies.
Hear From Our Technical Experts at the IMPACT Conference
Enhance Performance for High-Density Designs:
Carmichael Gugliotti, Product Manager for Primary Metallization, will discuss how combining direct metallization and viafill copper processes can improve the overall performance of high-density boards in the paper ‘Advanced Viafill Reliability Using Direct Metallization Technology’ on October 23 during the HDI, IC Substrate and FPC Technology - 1 session.
Ensure High PCB Fabrication Quality:
Frank Xu, Technology Manager – Final Finishes, will present solutions for fabricators facing new challenges with the revision of IPC 4552A for ENEPIG finished printed circuit boards. Discover more in his presentation, ‘The Impact of Recent Revision of ENEPIG Specification - IPC 4556-A’ on October 24 during the Test, Quality, Inspection and Reliability/Simulation session.
Improving Advanced IC Substrate Efficiency:
Saminda Dharmarathna, R&D Line of Business Partner – IC substrates, discusses the potential performance and efficiency benefits of optimizing redistribution layer and embedded trench plating processes for advanced IC Substrates in the paper, ‘Advanced Electroplating Processes for IC Substrates – Redistribution Layer and Embedded Trenches’ on October 25 during the Advanced Packaging Technologies – 4 session.
The TPCA Show is Taiwan’s largest tradeshow for Printed Circuit Board manufacturing. Celebrating its 25th Anniversary, the show will focus on key topics including PCB manufacturing, test, raw materials and chemicals, dry and wet process equipment, SMT equipment and test, environmental manufacturing and equipment, thermal management and packaging.
IMPACT 2024 is the premier conference for PCB and packaging professionals in Taiwan. The symposium will focus on the theme ‘IMPACT on Sustainable Technology’ exploring the latest electronic technologies and fostering collaboration among enterprises and organizations.