News & Events

Image
MacdermidAlpha-Market
Image
News_APEX 2021_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Interconnect Technologies Promoted and Microvia Reliability Presented at the 2021 Virtual IPC APEX Exhibition and Conference
MacDermid Alpha Electronics Solutions will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Image
News_STAYDRY H2-3000PSA_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - STAYDRY® H2-3000PSA: Hydrogen & Moisture Getter Film
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.
Image
News_HiTech Cornerfill and Underfill_Product Release_2Sep2021
Assembly
Press Release
Product Launch - ALPHA HiTech High Tg, Low CTE Underfill & Cornerfill Bonding Materials
The Assembly Division announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Image
News_Alpha OM-372_Product Release_2Sep2021
Assembly
Press Release
Product Launch - New Innovative Solder Paste Enabling Next Generation High Density Assembly Designs
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
Image
News_IECE HKPCA 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Technology Offerings Promoted at the International Electronics Circuit Exhibition
MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center, China.
Image
News_Heliofab AG 7921_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages
MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
Image
News_Sustainability_31Aug2021
Assembly
Press Release
MacDermid Alpha Offers Full Line of Environmentally Friendly, REACH Compliant Soldering Products
In line with the latest REACH Annex XIV regulations banning the use of Nonylphenol Ethoxylate (NPE) and Octylphenol Ethoxylate (OPE) based surfactants due to come into effect in Europe on the 4th January 2021, MacDermid Alpha is ready to offer customers soldering products that ensure compliance to the regulation.
Image
News_PCIM Asia 20_31Aug2021
Assembly
Press Release
Presentation on Power Package Attach by Silver Sintering at PCIM Asia Conference
The Assembly Division will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Image
News_CircuEtch 200_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - CircuEtch 200 Anisotropic Final Etch for SAP and mSAP
MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
Image
MAES
Assembly
Press Release
Sintering Products Introduced at the Step-by-Step Technical Conference in China
The Assembly Division of MacDermid Alpha Electronics Solutions will present “Introduction to Sintering Products” at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.
Image
News_VF TH 300_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - MacuSpec VF-TH 300 V-Pitting Resistant Pattern Plating Metallization for Advanced HDI PCBs
MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
Image
China Powertrain
Assembly
Press Release
Power Electronics Solutions Featured at China Powertrain Electrification and Innovation Summit
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper, “Alpha Power Electronics Solutions” at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.
What do you need solved?
Let our experts find your solution.