Webinar offered on Innovative Low Temperature Solder Solutions for Defect-free Next Generation Package Designs

Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.

Topics to be covered during this webinar include:

• Develop an understanding of distinct differences between traditional SnBi alloys and next generation low temperature alloys, such as HRL1
• Compare drop shock and thermal cycling data for HRL3 to baseline surface mount technology (SMT) alloys, such as SAC305
• Detail the effect low temperature solders have on warpage induced defects, such as non-wet-open (NWO) and head-in-pillow (HiP)
• Learn how low temperature solders have the potential to enable next generation package designs.

To register for the panel, please visit the Globalspec registration page.

Discover more Low Temp Solutions, here.