Product Launch - HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Reflectivity of the leadframe surface is a key factor in LED packaging design. Leadframe based LED package manufacturers require a high brightness silver spot plating process that ensures a proper surface for die attach and wire bonding during assembly. The silver finish must also provide lasting reflectivity during end use performance.

MacDermid Enthone’s HELIOFAB AG 7921 spot silver electroplating process consistently deposits highly reflective silver with measured GAM values around 2.0 over a wide current density window of 10 to 70 ASD. The bath produces a stable deposit over the standard 100 AH/L industry bath life metric. The deposit passes all standard testing for LED performance such as 1000-hour luminous decay as well as assembly functional testing for gold wire bond pull and die attach shear strength. The process is currently in high volume production and is specified for OEM use in leadframe LED manufacturing.

“With the release of HELIOFAB AG 7921 we have further broadened our comprehensive portfolio of solutions for leadframe based packages and look forward to helping customers solve manufacturing issues with this highly important and versatile type of IC packaging. The innovative white bright deposit provided by HELIOFAB AG 7921 delivers enhanced LED performance while reducing manufacturing costs through spot plating selectivity.” – Rich Retallick, Director of Electronics Specialties, Circuitry Solutions.

For more information on HELIOFAB AG 7921, please visit MacDermidAlpha.com