Transformative Next-generation Acid Copper Electroplating Process Enables High Performance and Enhanced Reliability for Advanced Packages

MICROFAB SC-40 PLUS represents a leap forward in semiconductor manufacturing with a transformative solution addressing demands for increased miniaturization and advanced packaging for artificial intelligence (AI), the internet of things (IoT), and mobile devices. This technology combines precision, efficiency, and ease of use, allowing fabricators to meet the industry’s requirements for high performance and enhanced reliability in advanced applications.

With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS provides a high-purity deposit with superior within-wafer, within-die, and within-feature uniformity, delivering high reliability and optimized process cost for semiconductor fabricators. The versatile chemistry is suitable for bump, pillar, and RDL metallization while also compatible with and without a nickel barrier process for Kirkendall void (KV) free stacks.

"MICROFAB SC-40 PLUS is a significant advancement in semiconductor manufacturing," explains Ashley Kuppersmith, Product Manager – Wafer Level Packaging at MacDermid Alpha. "It offers the industry a transformative solution that seamlessly integrates precision, efficiency, and ease of use. This innovative copper pillar plating process is a versatile product that can accommodate a wide variety of technological applications. MICROFAB SC-40 PLUS’ unique chemistry ensures high-purity and high-speed plating facilitating uniformity and reliability across advanced packaging solutions. Semiconductor fabricators can streamline their processes and achieve unparalleled results, ushering in a new era of semiconductor fabrication with MICROFAB SC-40 PLUS."

MacDermid Alpha’s MICROFAB SC product range encompasses products and processes that have supported the semiconductor industry for over 10 years.

To find out more reach out to a member of our team: www.macdermidalpha.com/contact-us