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Product Overview
Which finish is best? The one that satisfies your customer while maximizing your profit. Let us guide you through the complexities of surface finishing applications. With extensive OEM involvement worldwide, we know the issues governing finish selection, and will exceed your requirements at fabrication. From process ease, to corrosion prevention, to superior solderability, to wire bond reliability, we know finishing – like no other.
Product Features
- ENEPIG final finish for gold wire bondability
- ENIG final finish for reliable solderability with long shelf life
- Organic solderability preservative
- Consistent and stable processes with minimal precious metal consumption
Which finish is best? The one that satisfies your customer while maximizing your profit. Let MacDermid Alpha guide you through the complexities of surface finishing applications. With extensive OEM involvement worldwide, we know the issues governing finish selection, and will exceed your requirements at fabrication. From process ease, to corrosion prevention, to superior solderability, to wire bond reliability, MacDermid Alpha knows finishing – like no other.
Systek Advanced Packaging Brochure (EN)
ENTEK Plus HT Sales Sheet (EN)
A New Surface Finish for the Electronics Industry Technical Publication EWC 2014 (EN)
Achieving A Successful ENIG Finished PCB Under Revision A Of IPC Technical Publication SMTAI 2017 (EN)
Cyanide Free Immersion Gold Suitable For Pcb Surface Finishing Technical Publication SMTAI 2015 (EN)
Electroless Nickel - Immersion Silver: A New Surface Finish for Pcb Applications Technical Publication SMTAI 2012 (EN)
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating Technical Publication APEX 2013 (EN)
Organic Solderability Preservative
The ENTEK® PLUS IC is a production proven process that applies a metal-free final finish that enables a solder joint directly onto a copper pad. The coating appearance and performance does not change after multiple lead-free reflow cycles and is compatible with mixed metal operations. Selectively depositing on copper only, the ENTEK PLUS IC bath has a high degree of coating thickness control that is unique compared to other OSPs.
Wire Bondable ENEPIG Final Finish
A gold surface that is receptive to highly sensitive wire bonding and soldering operations is an important feature in IC substrate designs. The Affinity™ ENEPIG process plates a nickel-palladium-gold surface that consistently provides the foundation for strong gold wire bond and excellent solder joint strength. The process is chemically stable and does not plate extraneously between pads. Carefully balanced to prevent plate out, the palladium tank maintenance is predictable over a long bath life.
High Performance Nickel-Gold Final Finish
Electroless nickel-immersion gold finishes are widely used to create a reliable surface for solderability with long shelf life. With co-optimized nickel and gold plating technologies, Affinity ENIG deposits a nickel gold finish with extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness. The process has the tight gold thickness distribution which enables cost savings and improved solderability. The highly uniform electroless nickel allows for the lowest EN corrosion and strict adherence to IPC standards.
Let our experts find your solution.