News & Events

The Assembly Division of MacDermid Alpha Electronics Solutions will present three technical papers: “High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance”, “Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?” and “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” at the SMTA China East Technical Conference taking place from April 21-22 in Shanghai, China.

MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390V high reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.

MacDermid Alpha Electronics Solution was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.

MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

MacDermid Alpha Electronics Solution will present “Next Generation Electronic Materials for Structural and 3D In-Mold Electronics” at LOPEC 2021 Virtual Exhibition and Conference on March 25, 2021.

The Assembly Division of MacDermid Alpha Electronics Solutions is excited to announce a new distribution partnership with Deery Brook for the sale and distribution of Alpha brand products in Hungary, effective March 16th, 2021.

MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.

The Assembly Solutions division will introduce ALPHA OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

MacDermid Alpha Electronics Solutions will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

The Assembly Division announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.