New Product Innovation Award for ALPHA OM-372 Solder Paste

Assembly

Press Release

Apr 12, 2021

MacDermid Alpha Electronics Solutions was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

Developed to respond to the demands of increased miniaturization, ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). The solder paste is optimized for fine feature applications requiring Type 5 and Type 6 powders. With excellent HiP and NWO performance, ALPHA OM-372 is ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components, such as those found in mobile, wearable, and computer devices.

“ALPHA OM-372 serves a critical need as miniaturization drives complexity of board designs” said Paul Salerno, Global Portfolio Manager for SMT Assembly. “This paste not only meets the most challenging fine-feature printing and reflow conditions, but provides superior electrochemical reliability performance required by these complex assemblies”.

Introduced in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

Link here for more information on ALPHA OM-372 Solder Paste.

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