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MacdermidAlpha-Market
Innolot MXE Yellow
Assembly, Semiconductor
Press Release
Empowering Electronics Assembly: Introducing ALPHA® Innolot® MXE Alloy
In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.
ADAS Ch 3
Assembly, Semiconductor
Multimedia
Advanced Driver Assistance Systems (ADAS): It’s Not What, It’s How
Read this article by Rainer Venz, on ADAS: It’s not what, it’s how...
Patent infringement PR - Logos
Assembly, Circuitry, Film and Smart Surface Solutions, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Electronics Solutions, Heraeus Electronics, and Henkel Win Patent Infringement Lawsuit Against Senju Group
Alpha Assembly Solutions (MacDermid Alpha), Heraeus, and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH, and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.
cooling board
Assembly, Semiconductor
Multimedia
Eliminating Hotspots On Printed Circuit Boards
With the continued miniaturization of automotive electronics, PCB (Printed Circuit Board) designers must consider the thermal demands in these smaller assemblies. This is especially true in PCBs that operate at high current-carrying capacity, as the increases in heat can lead to “hotspots”. In turn, these hotspots can cause warped, blistered, or even burnt boards, leading to premature component failure.
ADAS Chapter 3
Assembly, Semiconductor
Multimedia
Autonomust-feelings: Why Emotions Are Driving Autonomous Vehicle Brand Perception
Read this article by Lenora Clark, Director, Technology Marketing and ADAS on Why Emotions Are Driving Autonomous Vehicle Brand Perception
wafer-level_packaging
Assembly, Semiconductor
Press Release
Next-generation Tin Silver Bump Metallization Process improves precision, reliability, and performance.
MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry.
Teng Long
Assembly, Semiconductor
Multimedia
The EV Industry: China vs Rest of World - China's Distinct Culture and Technological Advancements in the Global EV Landscape
Q&A with Professor Teng Long, professor of power electronics at the University of Cambridge, UK.
EV India 3
Assembly, Semiconductor
Multimedia
“Drive Further” – Integrated circuit board assembly solutions for the fast-paced electric vehicle industry in India
With tech startups emerging to support the industry across the country, India’s electric vehicle (EV) market is developing at a record pace. This progress is not only transforming the transportation sector but also influencing daily life and the country’s economy.
Julien
Assembly, Semiconductor
Multimedia
Meet the Pioneers of Silver Sintering Technology for the Automotive Industry
Q&A with MacDermid Alpha’s Line of Business Director for Power Electronics, Julien Joguet, and Global Director of Strategic Accounts, Steve Brown
macdermid alpha business men are darkened silhouettes standing at rainbow-LED podiums in a dark room with neon blue backdrop on stage
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Opens New China Electronics Applications Center with Grand Celebration Ceremony
MacDermid Alpha Electronics Solutions celebrated the highly anticipated grand opening of its China Electronics Applications Center (CEAC) on June 2, 2023, in Pudong New Area, Shanghai. The center’s state-of-the-art capabilities encompass a wide range of services, including the rapid development of prototypes, precise reliability testing, and the exploration of ground-breaking application techniques.
Advanced Sintering Material
Semiconductor
Press Release
Element Solutions Inc Announces Two Strategic Semiconductor Transactions
Element Solutions Inc (NYSE:ESI) ("Element Solutions" or the “Company”), a global and diversified specialty chemicals company, announced two transactions to enhance its capabilities and deepen customer relationships in advanced electronics materials markets. Together, these transactions represent approximately $15 million of annualized adjusted EBITDA with significant growth potential as electronics markets improve and certain new technologies win customer qualifications.
argomax
Semiconductor
Press Release
MacDermid Alpha Electronics Solutions expands its world-renowned Argomax® sintering technologies
(Waterbury, CT USA) – April 6, 2023 – MacDermid Alpha, has expanded the Argomax® technology offering. Argomax® 2141 is a new silver sintering product, designed for electric vehicle power inverters. The sintered joint enables the fabrication of smaller, lighter, and reliable power train systems.
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