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5G Solutions

Enabling 5G From Start to Finish

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Affinity™ 2.0

Electroless Nickel / Immersion Gold

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Affinity™ 3.0

Hybrid Gold Technology for ENIG/ENEPIG Final Finishes

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AlphaSTAR®

Immersion Silver for Lead-free Soldering

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Blackhole®

Direct Metallization

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Blackhole® LE

Low Etch Carbon-Based Direct Metallization System

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CircuEtch 300

Anisotropic Final Etching Process for SAP and mSAP

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Eclipse™

Direct Metallization

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Eclipse™ LE

Low Etch Carbon-Based Direct Metallization System

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Electrolytic Copper Metallization

Product Selection Guide

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Enklad Pretreatment

High Performance Pretreatment for Memory Disk

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ENTEK® Plus HT

Organic Solderability Preservative

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