Explore Technical Publications Documents

Measuring Copper Surface Roughness for High Speed Applications

IPC APEX 2015

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No Bleed Die Attach to Roughened Lead frame
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Optimization of Die Attach to Surface-Enhanced Leadframes for MSL-1 Performance for QFN Packages (Part 1)

Chip Scale Review 2017

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Optimization of Die Attach to Surface-Enhanced Leadframes for MSL-1 Performance for QFN Packages (Part 2)

Chip Scale Review 2017

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Optimized Semi-Additive Process for Polyimide as Dielectric in Build Up Packages

IPC APEX 2015

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Optimizing Morphology of Plated Copper Sub Assemblies Through Oxide Alternative Process

ECWC 2013

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PCB Surface Finishes: A General Review

SMTNet 2015

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Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

SMTA International 2019

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Pilot Production of High Efficient Metal Catalyzed Textured Diamond Wire Sawed mc-Si Solar Cells Combined with Nickel-Copper Plated Front Contact Processing

EU PVSEC 2017

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Pit Resistant Acid Copper Electroplating Process for Flash Etching

SMTA International 2020

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Process Improve Strategies for Weak MicroVia Interface

IPC APEX 2021

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Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating

IPC APEX 2013

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