Explore Technical Publications Documents

RDL and Pillar Fabrication from a Versatile Copper Plating Process
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Reliability Testing of Oxides and Oxide Alternatives for Inner Layer Bonding

IPC APEX 2015

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Reliable Contact Formation for Industrial Solar Cells by Laser Ablation and Ni/Cu Plating

EU PVSEC 2014

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Silver & Change: A Tale of Silver, Copper, Nickel and Gold

PCB007 2015

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Single Step Metallization Process for the Filling of Through Holes with Copper

IMPACT 2020

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The Co-Evolution of Carbon-Based Direct Metallization Alongside High Density Interconnect Technology

PCB007 2020

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The Co-Evolution of Carbon-Based Direct Metallization Alongside High Density Interconnect Technology (Chinese)

China PCB007 2020

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The Effects of Board Design on Electroplated Copper Filled Thermal Vias for Heat Management

SMTA SE Asia 2017

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The Total Environmental Solution for Any-Layer HDI Production

IPC APEX 2014

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To Quantify a Wetting Balance Curve

IPC APEX 2015

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Use of Carbon Nanoparticles for the Flexible Circuits Industry

SMTA International 2013

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Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution

IPC APEX 2018

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