Copper Via Fill

The MacuSpec VF Series via filling copper metallization solutions are the production proven standard for via filling in electronic devices used worldwide for over 20 years. With options that are applied to fit every application in the HDI market, the MacuSpec VF processes provide the most stable and consistent via filling available in the market today.

The MacuSpec AVF series are advanced via fill copper metallization processes for high density interconnects. The AVF technology allows for minimal surface copper under a wide variety of plating conditions. The unique formula of chemical components and equipment parameters enables customers to plate a broad range of blind micro via sizes in just one bath without the need of flash plate.

The filled micro vias created by AVF series baths have an extraordinary degree of repeatability while also adhering to IPC 6012D 3.2.6.2 standard.

The VF-TH Series are copper plating baths that can simultaneously fill copper micro vias and plate through holes with aspect ratios of up to 5:1 on a wide range of structure sizes with great physical properties.

MacuSpec VF-TH technology reduces the number of processing steps without a reduction in reliability. The MacuSpec VF-TH 300 process also eliminates post plating annealing by plating a deposit that is resistant to V-pitting during etching. The copper deposited from the VF-TH Series baths has superior physical properties, passing IPC 6012D, DS, and 6013D standards. These standards require tensile strength to be no less than 40,000 PSI and elongation to be no less than 18%.