Low Voiding Solder Preforms

Solder preforms can contribute greatly to the reduction of voids in a solder joint. Lower voids generally mean overall improved conductivity, thermal management and mechanical reliability.

Leading Solder Preform Solutions

PRODUCT NAME	DESCRIPTION	KEY FEATURES
ALPHA Exactalloy Standard Tape & Reel Preforms	Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.	Selective solder volume increase for solder joint strengthening Enables 100% hole fill Reduces flux residue for ICT
ALPHA AccuFlux BTC-578 Preforms	Increase solder volume for joint reliability, reduce flux residue for improved electrical reliability and void reduction under component thermal pads.	Efficient heat dissipation through consistently low voids Enhanced process stability and predictable reliability through repeatable void distribution Maximizes mechanical integrity through increased solder volume
ALPHA TrueHeight Spacer Blocks	Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device.	Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology. Easily integrate into standard SMT assembly using standard Tape and Reel Packaging

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Low Voiding Solder Preforms

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