News & Events

Senthil Kanagavel, Director of Product Development, delves into the pivotal shift toward PFAS-free die attach adhesives in the fabrication of wire bond semiconductor packaging. He begins by detailing the history of PFAS, highlighting environmental and health concerns and the increasing regulatory restrictions driving the urgency of this transition. Senthil then explores the evolution of the semiconductor packaging industry and the role PFAS has played in die bonding. He then examines challenges faced by packaging houses as they transition to PFAS-free die attach materials and concludes by offering a roadmap for success, guiding industry professionals through this critical change.

In this paper, we highlight the importance of thermal management in electric vehicle (EV) motors. Focusing on the EV motor market for two-wheeled vehicles, we explore how thermally conductive potting compounds are employed to significantly reduce their operating temperature. This enhances performance and extends the life of EV motors.

MacDermid Alpha Electronics Solutions Launches MICROFAB® SC-40 PLUS to meet the latest advancements in semiconductor manufacturing.

MacDermid Alpha, a global leader in integrated solutions for the electronics and automotive industries, is proud to participate in the EACC 2024 Future Cockpit Conference & Trade Show at Booth D038. The trade show is scheduled to take place on June 21-22 at the Suzhou International Expo Centre, in China.

Read this Q&A article with Clark Dai, one of our EV Technology market managers, as he explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry.

We are on the cusp of a major breakthrough within the world of automotive. Among the changes that are set to redefine every facet of mobility are developments such as electrification and autonomous driving.

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry is honored to support Meiko Electronics Co., Ltd. on their first installation of the carbon-based direct metallization technology for rigid PCB applications in Japan.

William Yu, our business development manager, won the Best Paper Award at the 2024 SMTA China East Technology Conference for the technical paper: Next-generation High-reliability Solder for Enabling Enhanced Thermo-mechanical Performance in Automotive Applications.

Q&A with MacDermid Alpha’s Director of R&D Applications

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.

Read this article by Rainer Venz, on ADAS: It’s not what, it’s how...