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IMAPS 57th International Symposium on Microelectronics
Enhance Performance and Reliability for Hybrid Bonding Applications
Producing metastable copper fine grains tailored for copper-to-copper hybrid bonding is crucial for applications with stringent thermal constraints. Pingping Ye, Senior R&D Scientist at MacDermid Alpha, explores the intricate evolution of copper microstructure, focusing on grain growth in her paper:
Paper: ‘Metastable Fine Grain Cu for Hybrid Bonding Applications’.
Date: October 1st at 16:45
Meet the Demands for High Reliability Interconnects
It is critical for semiconductor manufacturers, to develop new ways to make highly reliable interconnects using the most efficient and cost-effective technology while also addressing environmental concerns.
Stephen Lombardo, R&D Chemist – Wafer Level Packaging at MacDermid Alpha will discuss two of the latest barrier technologies for semiconductor packages in his paper:
Paper: ‘Boric acid-free Nickel Barrier and NiFe Alternative Barrier’
Date: October 3rd at 10:00.
Improve Semiconductor Device Reliability
Precisely controlling copper (Cu) grain size and orientation within vias is pivotal for ensuring integrated circuit reliability, in semiconductor manufacturing. Harshul Khanna, R&D Scientist at MacDermid Alpha will present a comprehensive study and invaluable insights into the precise manipulation of copper grain size and orientation using the bamboo process, holding significant promise for enhancing the reliability of integrated circuits in semiconductor manufacturing.
Presentation: ‘Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability’.
Date: October 3 at 10:00.
IMAPS 57th International Symposium on Microelectronics
This conference offers one of the most robust programs for microelectronics and advanced packaging technical content. The event includes professional development courses, followed by 3 days of technical sessions with emphasis on design, modelling and manufacturing; fanout, RDL, WLP/PLP; high performance/ high reliability; advanced package (flip chip, 2.5D, 3D, optical); advanced process and materials (enabling technology).