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Productronica India 2024

India Exposition Centre

Greater Noida
201306
India
Trade Show
Assembly
Semiconductor
Explore our advanced solutions at Productronica India 2024 and see how we deliver customer solutions across the entire electronics value chain. Visit us at Booth B55 to find out how we can optimize your product's performance and reliability.
Productronica India 2024
Productronica India 2024

We at MacDermid Alpha are thrilled to participate in Productronica India 2024. At the show, we will showcase a comprehensive suite of integrated solutions designed to meet the evolving needs of circuit board assembly, semiconductor manufacturing, wafer-level packaging, and circuitry solutions. Our offerings deliver unparalleled performance and reliability, meeting the highest standards in the industry. Our featured solutions include: 

Electrolube® Conformal Coatings: 

Safeguard your electronic components with our range of conformal coatings, which provide exceptional defense against humidity and condensation, electrochemical migration, and dielectric failures, ensuring the longevity of your assemblies in harsh environments.

Electrolube® Thermal Interface Materials (TIMs):

As electronics become more complex and generate more heat, effective thermal management is essential. We are significantly expanding our TIMs product line to include thermally conductive gap filling pads, one-part thermal gels, and thin dielectric sheets, aimed at enhancing system lifetimes and performance.

ALPHA® Hitech Solutions:

Our ALPHA® Hitech Solutions provide a comprehensive suite of high-performance adhesives, underfills, edgebonds, and encapsulants. Engineered to reduce package strain and enhance board-level reliability, these solutions are suitable for various applications, including automotive, camera modules, mobile devices, computing, white goods, and LED assemblies.

ALPHA® Argomax®:

Engineered sinter materials proven to deliver the best process times and reliability, featuring flexible and easy-to-use form factors. These advancements help reduce capital costs and accelerate time to market. Whether in semiconductor packaging or high-power electronics, Argomax® elevates performance and extends the lifespan of your devices.

As a global leader in material solutions, we deliver reliability through our expertise and data-driven material choices. Connect with our experts at Booth B55 to explore how our advanced offerings can elevate your electronic manufacturing processes. With a comprehensive portfolio of board-level technologies, we are dedicated to partnering on innovative solutions that streamline operations and drive progress for our customers. 

Click here to register as an attendee for the show