News & Events

We are delighted to announce our latest article featured in GlobalSpec has been published.
In this piece, we share our innovative solution to board-level reliability, particularly challenging in industries such as automotive and high-performance computing.

Revolutionizing High-Performance Power Electronics with Innovative Materials and Manufacturing Processes

In this paper, we highlight the importance of thermal management in electric vehicle (EV) motors. Focusing on the EV motor market for two-wheeled vehicles, we explore how thermally conductive potting compounds are employed to significantly reduce their operating temperature. This enhances performance and extends the life of EV motors.

Read this Q&A article with Clark Dai, one of our EV Technology market managers, as he explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry.

William Yu, our business development manager, won the Best Paper Award at the 2024 SMTA China East Technology Conference for the technical paper: Next-generation High-reliability Solder for Enabling Enhanced Thermo-mechanical Performance in Automotive Applications.

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.

Read this article by Rainer Venz, on ADAS: It’s not what, it’s how...

Alpha Assembly Solutions (MacDermid Alpha), Heraeus, and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH, and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

With the continued miniaturization of automotive electronics, PCB (Printed Circuit Board) designers must consider the thermal demands in these smaller assemblies. This is especially true in PCBs that operate at high current-carrying capacity, as the increases in heat can lead to “hotspots”. In turn, these hotspots can cause warped, blistered, or even burnt boards, leading to premature component failure.

Read this article by Lenora Clark, Director, Technology Marketing and ADAS on Why Emotions Are Driving Autonomous Vehicle Brand Perception

MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry.

Q&A with Professor Teng Long, professor of power electronics at the University of Cambridge, UK.