MacDermid Alpha Electronics Solutions to Showcase New Innovations and Industry Expertise at IPC APEX EXPO 2025

MacDermid Alpha Electronics Solutions a leading innovator of integrated materials and solutions in the electronics industry, will be attending the highly anticipated IPC APEX EXPO, taking place March 18 to 20 at the Anaheim Convention Center, California. The company will be showcasing its latest groundbreaking product, ALPHA® HiTech® CF31-4026, a new reworkable edgebond designed to address key challenges in the electronics industry, alongside a series of insightful discussions by four of their esteemed industry experts.

At this year’s event, MacDermid Alpha will unveil ALPHA HiTech CF31-4026, an innovative solution purposefully engineered for high-temperature applications. Dedicated to addressing real-world industry challenges, this new product enables component reworkability, reinforces reliability, and supports manufacturing sustainability initiatives.

"We are excited to be part of the 25th anniversary of the IPC APEX EXPO, and share our innovations with the industry,” said Paul Salerno, Director of SMT & Preforms of MacDermid Alpha. "As complexity in the electronics industry continues to evolve, identifying solutions that enhance assembly reliability while improving yields and addressing corporate sustainability is crucial. Our commitment remains focused on providing solutions that optimize performance and create long-term value for our customers."

In addition to showcasing ALPHA HiTech CF31-4026, MacDermid Alpha will be taking part in the Technical Conference, with four of their leading industry experts presenting. These experts will delve into the key challenges and opportunities currently facing the industry.

Session: PCB Fabrication and Materials – Platings and Surface Finishes

• Date: March 18
• Speaker: Frank Xu, Ph.D., Global Product Manager
• Topic: Emerging PCB final finishes and their role in meeting the challenges of 5G and high-frequency applications, highlighting alternatives to HASL like ImAg, ImSn, ENIG, and ENEPIG.

Session: Soldering Materials and Processes Technologies

• Date: March 19
• Speaker: Anna Lifton, R&D Director
• Topic: Strategies for improving reliability in BGAs and WLCSP with high-reliability solders and polymer reinforcements, focusing on automotive applications.

Session: Protective Coatings

• Date: March 19
• Speaker: Bethany Turner, Senior Technical Manager
• Topic: Enhancing ruggedized polymer coatings for high-density electronic assemblies in harsh environments.

Session: Sustainability for Electronics: PCB Materials and Processes

• Date: March 19
• Speaker: Elise Baker, Sustainability Specialist
• Topic: A comprehensive sustainability comparison of primary metallization processes, focusing on how Direct Metallization technologies reduce environmental impact while maintaining reliability.

"We believe that sharing our expertise and fostering open dialogue about the challenges we face in the electronics industry is critical,” added Kurt Graulich, Senior Director – Commercial Americas. “These discussions are part of our ongoing commitment to driving innovation and shaping the future of the industry.”

MacDermid Alpha invites all attendees to visit its booth #1042 to experience firsthand the potential of ALPHA HiTech CF31-4026 and to engage with the experts leading these important conversations.