Productronica China 2025

As the electronics industry pushes the boundaries of miniaturization, high-power density, and extreme reliability, manufacturers face mounting challenges in thermal management and assembly durability. At Productronica China 2025 (March 26–28, Booth 4700 in Hall E4), MacDermid Alpha Electronics Solutions will introduce breakthrough solutions designed to redefine performance standards in semiconductor packaging and circuit board assembly.

Headlining the showcase is the ALPHA^® Hitech CF31-4026, a next-generation reworkable edgebond, engineered to enhance board-level reliability while reducing waste and cost—a critical advancement as manufacturers strive for more sustainable, high-performance designs. Alongside it, Kester Indium STIM (Solder Thermal Interface Material) tackles the thermal bottleneck in high-power applications, ensuring efficient heat dissipation for AI-driven data centers, electric vehicles, and advanced 5G infrastructure.
These industry-first solutions come at a pivotal time when electronics manufacturers are under increasing pressure to improve thermal performance, extend product lifecycles, and minimize environmental impact. By addressing these pressing challenges, MacDermid Alpha is not just launching new products—it’s setting the stage for the next evolution in power electronics and high-reliability assembly.

Join us at Productronica China 2025 to experience the future of electronics manufacturing.