MacDermid Alpha Electronics Solutions to showcase at SMTA Electronics in Harsh Environments Conference

Join Us at SMTA Harsh Environments – May 21-22

Electronics operating in extreme conditions demand materials and processes that deliver long-term reliability. Our experts will present innovative research and proven material strategies that enhance board-level reliability. Gain insights into material selection, environmental protection, and performance optimization, and discover solutions designed to reinforce and protect electronics in most demanding conditions.

Technical Presentations: Advancing Reliability in Harsh Environments

Innovative Material Reinforcement Strategies for Advanced Packaging Solutions in Automotive Electronics presented by Anna Lifton, Director of R&D Applications.

In this presentation, Anna will explore the impact of Underfills and Edgebonds in enhancing board-level reliability (BLR) for advanced semiconductor packages. As automotive electronics adopt finer-pitch, high-density packages, thermomechanical reinforcement becomes essential, without compromising electrochemical reliability. This study evaluates the compatibility of various MacDermid Alpha solder pastes and reinforcement materials to ensure both mechanical strength and long-term stability.

By analyzing different test conditions and temperature effects, this research provides insights into optimizing material selection for reliable semiconductor assemblies. Join Anna to learn how balancing mechanical reinforcement with electrochemical performance is critical for advancing next-generation electronic packaging.

A Comparison of Methodologies to Determine the Protective Capabilities of Conformal Coatings in Cyclic Condensing Environments presented by Beth Turner, Senior Technical Manager.

In this session, Beth Turner will discuss the importance of condensation resistance in printed circuit board assemblies (PCBAs) and how conformal coatings help prevent failures in harsh environments. While thicker coatings can improve protection, excessive thickness may introduce reliability issues. Balancing material coverage and performance is essential for ensuring PCBA durability. Join Beth to delve into the findings on condensation resistance using two test methods: a step-down cyclic test to identify failure points and a continuous cycling test to simulate real-world conditions.

Learn More About Our Integrated Solutions  

At our tabletop, our team of experts will be excited to meet with you and discuss your specific needs for electronics in harsh environments. Explore our range of integrated solutions, including solder paste, polymers, and solder alloys, all designed to withstand extreme environmental conditions.

Our Product Manager for Electrolube® Conformal Coatings, Saskia Hogan, will be available to answer any questions about Conformal Coatings and demonstrate how our solutions protect electronics in the harshest conditions.

Additionally, Chris Klok, Sr. Manager - Strategic Marketing, will discuss our projects with automotive OEMs, sharing key insights and lessons learned in ensuring reliability in extreme environments. He will also showcase our collaboration within the Circ-Uits consortium, an initiative focused on enhancing sustainability in electronics manufacturing. One of our key contributions is the development and implementation of Low-Temperature Solder (LTS) solutions. By optimizing soldering processes at lower temperatures, we help reduce energy consumption, minimize thermal stress on components, and extend product lifecycles—all while maintaining the reliability and performance demanded by harsh environments.

Join us to discover advanced materials and technologies designed to deliver exceptional performance and reliability, even in the harshest environments!