Visit MacDermid Alpha Electronics Solutions at the PCIM Expo & Conference – Europe 2025

MacDermid Alpha at PCIM Europe 2025: Advancing Bond Pad & Sintering Solutions

We’re excited to introduce our latest material innovations for power packages at PCIM Europe 2025, taking place in Nuremberg, Germany, from May 6-8. You can find us in Hall 7, Booth 460, where we’ll be showcasing our comprehensive portfolio of sintering materials, solder preforms, and alloys—all designed to enhance power module reliability and performance.

This year, we’re highlighting two key innovations:

• Bond Pads with Argomax^® Sinter Film – Our patented Argomax^® sinter film is laminated onto a metal interface, creating a bond pad specifically designed to receive power connections and enhance long-term reliability. This innovation ensures higher yields and durability in demanding applications such as EV power modules, renewable energy systems, and industrial electronics.
• Argomax^® AccuLam™ 8022 Sinter Film – A next-generation material engineered for superior thermal and electrical performance in power electronics. Designed for thin die assemblies, it reduces sintering material waste during production, optimizing manufacturing efficiency.

As the industry moves toward higher power densities, increased manufacturing yields, and extended reliability, the need for high-performance materials to unlock the full potential of SiC dies has never been greater.
We’ll also be showcasing:

• Argomax^® Sintering Film & Paste – Our high-density, high-conductivity die attach solutions that improve thermal and power cycling reliability.

Discover Bond Pad Innovations at the Exhibitor Stage Presentation

At the Exhibitor Stage, John Hynek, Global Product Manager for Power Electronics, will present " Bond pad for die top attach for power electronics applications ". Join John at the Exhibitor Stage for an in-depth look at the latest advancements in bond pad technology and their critical role in die top connections. Learn how these innovations are shaping the manufacturing and application of power packages, improving performance, efficiency, and reliability in power electronics. Don't miss this opportunity to explore cutting-edge solutions driving the industry forward!

MacDermid Alpha at PCIM Conference 2025 – Innovations in Thermal Management & Reliability

In addition to our booth activities, we will be presenting at the PCIM Europe Conference 2025 on Tuesday, May 6th. Join us in Halle 10.1, from 12:45 - 14:15, for the Thermal Management Measurement session. Andres Socarras, Senior Applications Engineer, will present a paper titled "Reliability Assessment of Sinter and Solder Interconnections at Power Module-Heatsink Level". This study explores the critical role of interconnect materials between power devices and heatsinks in ensuring performance and reliability. It compares nanomaterial-based pressure-assisted sinter technology with high-performance flux-less solder alloys, utilizing Power Cycling and Thermal Cycling tests based on the ECPE Automotive Qualification Guideline AQG324. Co-authors include Maurizio Fenech and Guilherme Barboza.

Visit Us at Hall 7, Booth 460

“With the rapid evolution of EV powertrains, renewable energy, and advanced semiconductor packaging, bond pad materials play a crucial role in ensuring reliability,” said Klaus Alzner, Regional Commercial Director, Europe. “We’re excited to demonstrate how MacDermid Alpha’s solutions help manufacturers meet these evolving challenges.

Don’t miss the opportunity to see live demos, engage in technical discussions, and explore product showcases. Discover firsthand how our cutting-edge materials can transform semiconductor assembly and elevate the future of power electronics.