Excellent Printing and Dispensing Performance

Our no clean and water soluble solder pastes for component attach, die attach and wafer bumping applications meet challenging lead-free and eutectic processing needs. These products were developed to deliver excellent printing and dispensing performance, while maximizing process throughput and yield.

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Designed for T5, T6 and T7 SAC305 Processing, for Apertures < 70μm. (008004 compatible).
  • Excellent print consistency with high throughput capability across multiple package designs.-
  • Halide and halogen-free formulation
  • Excellent wetting and solderability with minimum voiding on various finishes (Cu, CuOSP, NiAu)
  • Low temperature, easy to remove water soluble flux residues in standard DI washing (< 40°C)
  • High reliability no clean flux residues able to pass IPC SIR and electromigration requirements
Low Voiding and High Reliability Solder Joints

Our no clean and water soluble solder pastes are specially developed with unique flux chemistry systems that provide robust soldering with low voiding to various pad finishes to enable a highly reliable solder joint.

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  • ALPHA® WS-699CPS

    Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance.

    • Low voiding performance
    • Maximizes reflow yield for lead-free processing
    • Excellent print consistency with high process capability index
    • Reduction in random solder balling levels, minimizing rework and increasing first time yield
  • ALPHA® WS-698CPS

    High activity, water soluble, lead-free solder paste capable of high soldering yields with low voiding and excellent residue cleaning performance.

    • Low voiding performance
    • Maximizes reflow yield for lead-free processing
    • Excellent print consistency with high process capability index
    • Reduction in random solder balling levels, minimizing rework and increasing first time yield
  • ALPHA® WS-693CPS

    Water soluble, lead-free solder paste which meets zero-halogen requirements with low voiding and excellent residue cleaning performance.

    • Very low voiding performance
    • Excellent solder joint and flux residue cleaning performance 
    • Robust tack force ensures high pick-and-place yields, good self-alignment
  • ALPHA® NCP-LR002

    No-clean, lead-free solder paste that enables low residue post reflow with low voiding and excellent soldering performance.

    • Almost “no residue” cosmetic appearance
    • Excellent voiding performance
    • Excellent print consistency with high process capability index across all board designs 
    • Wide reflow profile window with good solderability on various board
  • ALPHA® NCP-390

    No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance.

    • Excellent solder joint and flux residue cosmetics 
    • Excellent voiding performance
    • Long stencil life: consistent performance for at least 8-hours of continuous printing
    • Robust tack force ensures high pick-and-place yields, good self-alignment
  • ALPHA® NCP-1213

    High lead, zero-halogen, no clean solder paste designed for high power, high performance, die attach applications.

    • Excellent voiding performance on die attach applications
    • Excellent dispensing consistency
    • High reliability die attach connection for high power semiconductor applications
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