Product Overview

MICROFAB CUMSA100 is a high-purity electroplating process which produces equiaxed-grained matte copper deposits. It is specially formulated for use in the fabrication of bump/pillars on semiconductor wafers. High-build bumps/pillars can be produced on fine semiconductor patterns for excellent performance.

Features

  • Wide operating window
  • High purity
  • Ease-of-use
  • Low voiding

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Single Additive System

With a proven scalability down to very small features < (10x10 μm), the single additive system leads to simplicity in maintenance with a wide operating window.

Plating Copper-Macdermid Alpha
Plating Copper-Macdermid Alpha

Robust Wafer Plating Process

MICROFAB CUMSA100 is a robust wafer plating process ideal for high volume manufacturing, capable of producing copper pillars with surface roughness less than 100 nm and generating different topographies (dimple, flat, and doom).

MICROFAB CUMSA100

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB CUMSA100

Pillar/Post
RDL

Wide Operating Window
High Purity

Ease-of-Use
KV Low

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Ideal High Purity Copper Pillar for Solder Cap and C4 Bumps

Historical POR for WLP and compound semiconductor; MICROFAB CUMSA100 is ideal for applications where purity and plating rate are a must.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors Power Semiconductor Optoelectronics Packaging

Ideal High Purity Copper Pillar for Solder Cap and C4 Bumps

Historical POR for WLP and compound semiconductor; MICROFAB CUMSA100 is ideal for applications where purity and plating rate are a must.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors Power Semiconductor Optoelectronics Packaging

Ideal for Pillars and Conformal Films

Historical POR for backside heatsinks with barrier on GaAs, GaN and SiN. High purity pillar for barrier free, low KV performance.

UBM Backside Metal Wafer Bumping RDL Pillar / Post Thermal Management

Ideal for Pillars and Conformal Films

Historical POR for backside heatsinks with barrier on GaAs, GaN and SiN. High purity pillar for barrier free, low KV performance.

UBM Backside Metal Wafer Bumping RDL Pillar / Post Thermal Management

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Ideal High Purity Copper Pillar for Solder Cap and C4 Bumps

Historical POR for WLP and compound semiconductor; MICROFAB CUMSA100 is ideal for applications where purity and plating rate are a must.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors Power Semiconductor Optoelectronics Packaging

Ideal High Purity Copper Pillar for Solder Cap and C4 Bumps

Historical POR for WLP and compound semiconductor; MICROFAB CUMSA100 is ideal for applications where purity and plating rate are a must.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors Power Semiconductor Optoelectronics Packaging

Ideal for Pillars and Conformal Films

Historical POR for backside heatsinks with barrier on GaAs, GaN and SiN. High purity pillar for barrier free, low KV performance.

UBM Backside Metal Wafer Bumping RDL Pillar / Post Thermal Management

Ideal for Pillars and Conformal Films

Historical POR for backside heatsinks with barrier on GaAs, GaN and SiN. High purity pillar for barrier free, low KV performance.

UBM Backside Metal Wafer Bumping RDL Pillar / Post Thermal Management
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