Technical Bulletins

是一种单组份、低温固化环氧树脂体系，对尼龙（PA9T）和金属基材具有出色的粘附力，能够很好地粘合液晶聚合物(LCP)和聚碳酸酯表面。

是一种单组份、低温热固化毛细底部填充剂。它专为需要增强机械强度的低温应用而设计，可组装至印刷电路板上的芯片封装。

A high-performance two-component conformal coating, designed specifically for selective coating processes.

A solution of pure water-white rosin in alcohol, meeting the requirements of Type R of MIL-F-14256D, designated as “Flux Soldering, Liquid (Rosin Base)”. This flux contains no activator additives, making this the least corrosive type of rosin flux available.

A solution of pure water-white rosin in alcohol, meeting the requirements of Type R of MIL-F-14256E, designated as “Flux, Soldering, Liquid (Rosin Base).”  This flux contains no activator additives, making this the least corrosive type of rosin flux available.

A solution of pure water-white rosin in alcohol, meeting the requirements of Type R of MIL-F-14256D, designated as “Flux, Soldering, Liquid (Rosin Base).”  This flux contains no activator additives, making this rosin flux the least corrosive type available.

A solution of high purity modified rosin in inert solvents.  This non-spattering, low fuming flux is specifically formulated for microelectronic applications. 

A Type OA flux formulated from organic compounds dissolved in a suitable solvent vehicle of highest purity./p>

A concentrate designed for the efficient removal of rosin flux residues from printed circuit boards using aqueous saponification processing. 

A cleaning concentrate designed for efficient removal of rosin flux residues from printed circuit boards using aqueous saponification processing.   

A soldering oil composed of a high quality, long lasting hydrocarbon oil and proprietary dross inhibiting additives.