Search
View Products in HiTech Edgebond
- ALPHA® HiTech® CF31-4026
Next-Generation, High Reliability, Reworkable Edgebond
- High Tg, ideal for automotive or other high-temperature application
- Low α1, enabling excellent TCT performance for board-level reliability
- A reworkable edgebond, removable at 185-200°C for high yield manufacturing and lower total cost of ownership (TCO)
- Superior slump performance, preventing material from spreading to solder interconnects beneath components, maintaining integrity and reliability in high-density PCBs
- Fluorescent appearance, enabling visual detection under UV light
- ALPHA® HiTech CF31-4010 Edgebond
ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
- A lower cost option to conventional underfilling process with increased productivity and lower material volume required
- High Tg and low CTE values drastically improve ability to pass more Stringent Thermal Cycling Test
- Reworkable
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech CF12-4485B Edgebond
A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components.
- A lower cost option to conventional underfilling process with increased productivity and lower material volume required
- Long Pot Life of 7 days
- Excellent Adhesion on FR4
- Halogen-free and complies with RoHS Directive 2015/863/EU
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.