Power Module Assembly

Sinter die attach enables a number of critical advantages for high power switching applications.

In the new generation of devices, the topside attachment to the die uses sintered clips or sintered copper foils. Clips and foils, laminated with ALPHA Argomax film, enable an assembly ready interconnect for a fully sintered solution.

A process that enables sintering from a small package to large area modules and low pressure sintering compatible with molded packages. Capabilities with flat dispensing and printing paste and preforms delivers high throughput.