Enabling Electronics Miniaturization

As electronic devices and equipment becomes more powerful and sophisticated, the circuit boards they use become more complex in design. This means varying board laminates, thicknesses and pad finishes. Components used on these assemblies may range in size from quite large to very small, be tightly spaced and incorporate EMI shielding, heat sinks or other signal or thermal management devices. Some board substrates and components may also be temperature sensitive.