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Assembly Solutions
  • Products
    • Solder Paste
    • Solder Preforms
    • Cored Solder Wire
    • Sinter Materials
    • HiTech Underfills
    • HiTech Edgebond
    • HiTech Adhesives & Encapsulants
    • Solid Solders
    • Liquid Flux
    • Recycling Services
    • Inks for In-Mold Electronics
    • Inks for Printed Electronics
    • Stencils
    • Electronic Cleaners
  • Solutions
    • Low Temperature Processing
    • Reduced Voiding in Solder Joints
    • Enabling Electronics Miniaturization
    • Reliability in Harsh End-Use Environments
    • Cost Effective Pb-Free Options
    • Regulatory Compliance and Corporate Sustainability
    • Bondline Control
    • SiC Die Attach
    • Thin Die Attach with Film
  • Applications
    • Circuit Board Assembly - Surface Mount
    • Circuit Board Assembly - Through Hole
    • Power Module Assembly
  • Markets
    • Automotive
    • Computing
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    • Consumer
    • High Reliability
    • Industrial Electronics
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  4. Chengdu, China

Chengdu, China

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Office Address

Room 405, First Building, New Angle Plaza, No. 668 Jingdong Road
Chengdu Shi
Sichuan Sheng, 610066
China

Office Numbers:

Phone P: +86 28 8446 0186
F: +86 28 8445 8560
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