Skip to main content
Home
  • News & Events
  • About Us
  • Contact Us
Search Search
Search
Assembly Solutions
  • Products
    • Solder Paste
    • Solder Preforms
    • Cored Solder Wire
    • Sinter Materials
    • HiTech Underfills
    • HiTech Edgebond
    • HiTech Adhesives & Encapsulants
    • Solid Solders
    • Liquid Flux
    • Recycling Services
    • Inks for In-Mold Electronics
    • Inks for Printed Electronics
    • Stencils
    • Electronic Cleaners
  • Solutions
    • Low Temperature Processing
    • Reduced Voiding in Solder Joints
    • Enabling Electronics Miniaturization
    • Reliability in Harsh End-Use Environments
    • Cost Effective Pb-Free Options
    • Regulatory Compliance and Corporate Sustainability
    • Bondline Control
    • SiC Die Attach
    • Thin Die Attach with Film
  • Applications
    • Circuit Board Assembly - Surface Mount
    • Circuit Board Assembly - Through Hole
    • Power Module Assembly
  • Markets
    • Automotive
    • Computing
    • Communications
    • Consumer
    • High Reliability
    • Industrial Electronics
    • Photovoltaics
  • Knowledge Base
    • Safety Data Sheets
    • Technical Bulletins
    • Flyers
    • Brochures
    • Technical Publications
    • Troubleshooting Resources
    • Responsible Sourcing
  • Brands
  • Locations
  • News & Events
  • About Us
  • Contact Us
Assembly Solutions
  • Products
    • Solder Paste
    • Solder Preforms
    • Cored Solder Wire
    • Sinter Materials
    • HiTech Underfills
    • HiTech Edgebond
    • HiTech Adhesives & Encapsulants
    • Solid Solders
    • Liquid Flux
    • Recycling Services
    • Inks for In-Mold Electronics
    • Inks for Printed Electronics
    • Stencils
    • Electronic Cleaners
  • Solutions
    • Low Temperature Processing
    • Reduced Voiding in Solder Joints
    • Enabling Electronics Miniaturization
    • Reliability in Harsh End-Use Environments
    • Cost Effective Pb-Free Options
    • Regulatory Compliance and Corporate Sustainability
    • Bondline Control
    • SiC Die Attach
    • Thin Die Attach with Film
  • Applications
    • Circuit Board Assembly - Surface Mount
    • Circuit Board Assembly - Through Hole
    • Power Module Assembly
  • Markets
    • Automotive
    • Computing
    • Communications
    • Consumer
    • High Reliability
    • Industrial Electronics
    • Photovoltaics
  • Knowledge Base
    • Safety Data Sheets
    • Technical Bulletins
    • Flyers
    • Brochures
    • Technical Publications
    • Troubleshooting Resources
    • Responsible Sourcing
  • Brands
  • Locations
  1. Home
  2. Assembly Solutions
  3. Locations
  4. La Seguiniere, France

La Seguiniere, France

Sales
  • Europe
  • France

Office Address

ZI la Bergerie
Rue Gustave Eiffel
49280 La Seguiniere
France

Office Numbers:

Phone P: +33 241 49 0011
F: +33 241 49 0019
What do you need solved?
Let our experts find your solution.
Contact Us
MAES ESI logos
Stay Updated
Sign up for news and updates.
Subscribe
  • Explore
    • Circuitry Solutions
    • Semiconductor and Assembly Solutions
    • Film and Smart Surface Solutions
    • Products & Solutions
    • Markets
  • About
    • News & Events
    • About Us
    • Contact Us
    • Customer Information
  • MacDermid Alpha Electronics Solutions is an Element Solutions business
    • Element Solutions Inc
    • MacDermidAlpha Automotive
    • MacDermid Enthone Industrial Solutions
    • MacDermid Envio Solutions
    • MacDermid Graphics Solutions
    • MacDermid Offshore Solutions
Stay Connected
LinkedIn
Twitter
Youtube

WeChat Icon

MacDermid Alpha Electronics Solutions is an Element Solutions business. 

© All Rights Reserved 2024.

  • Careers
  • Contact