Module Assembly - Shingling / Advanced Interconnection

An increasing number of high efficiency solar modules assembled today use overlapping solar cells which are joined in series using solder paste. These cell arrays are ultimately routed to a central junction box and distributed to the main system. Alpha solder pastes and cored wires are used in this process.

Key Requirements for Joining Materials

High deposition speeds with high Cp / CpK
Stable in harsh manufacturing conditions
Repeatable print volumes
Low spatter, high activity cored wires

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-5100 Consistent fine-feature print volume repeatability Low post reflow residue Minimizes random solder balling
Solder Paste	ALPHA OM-550 Best mechanical performance of Alpha’s low temperature solder alloys Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Low contact resistant Uniform IMC No silver leaching or solder ball formation
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Cored Wire	ALPHA Telecore HF-850 SAC305 / Sn60Pb40 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / Sn60Pb40 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0

Key Requirements for Joining Materials

High deposition speeds with high Cp / CpK
Stable in harsh manufacturing conditions
Repeatable print volumes
Low spatter, high activity cored wires

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-5100 Consistent fine-feature print volume repeatability Low post reflow residue Minimizes random solder balling
Solder Paste	ALPHA OM-550 Best mechanical performance of Alpha’s low temperature solder alloys Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Low contact resistant Uniform IMC No silver leaching or solder ball formation
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Cored Wire	ALPHA Telecore HF-850 SAC305 / Sn60Pb40 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / Sn60Pb40 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0

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Module Assembly - Shingling / Advanced Interconnection

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