Product Overview
These formable Dielectric Inks provide unparalleled performance benefits such as high break down voltage, high degree of formability, consistent print performance, resistance to ink wash-off during injection molding and strong adhesion to polymer substrates like Polycarbonate (PC) and PET (Polyethylene terephthalate).
Formable Dielectric Inks can be applied using screen-printing with either polyester or stainless-steel mesh. A wide range of mesh sizes can be used. Furthermore, many compatible substrates can be used including Polycarbonate (PC), PET, as well as other substrates and films suitable for in-mold electronics.
Product Features
- Can be deposited as pin-hole free layers that have excellent electrical insulation
- Well suited for high throughput, high speed printing
- Produce robust, reliable, and high-performance IME (In-Mold Electronics) products using high throughput processes
Formable Dielectric Inks can be deposited as pin-hole free layers that have excellent electrical insulation and are well suited for high throughput, high speed printing. They are compatible with MacDermid Alpha’s range of formable Silver Inks and formable Adhesives, as well as commercially available graphic inks. This inter-compatible suite of formable Dielectric Ink products ensures that customers can produce robust, reliable and high-performance IME (In-Mold Electronics) products using high throughput processes.
Highly formable, these Dielectric Inks can be used as Barrier Dielectrics, Cross-over Dielectrics and Circuit Encapsulation Materials to produce multilayered electronics circuits, that exhibit high electrical performance, as well as provide excellent environmental protection. These IME compatible Dielectric inks are tailored to meet the varying formability needs of diverse capacitive touch applications such as smart automotive interior surfaces, white goods control panels, smart packaging sensor surfaces and similar smart HMI (human machine interface) surfaces.