Product Overview
ALPHA Argomax 5040 Paste is a silver sintering paste specifically designed for die placement on wet paste (before drying) followed by low pressure sintering die attachment on copper finish surfaces.
Product Features
- Application: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Cu surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
Solution for high sintered joint reliability
ALPHA Argomax 5040 Paste is specifically designed for die placement on wet paste (before drying) followed by low pressure sintering die attachment on copper finish DBC substrates.
It is formulated using our proprietary engineered silver particles for improved attachment reliability with regular DBC without a gold or silver finish.
ALPHA Argomax 5040 Paste is formulated for print or small area dispense, long stencil life, and dog ear mitigation and easy tacking.
Related Products
Product Type | Product Name | Compatible Surface Finish | Product Application Method | End Application |
---|---|---|---|---|
Sinter Paste | ALPHA Argomax 5022 Paste | Die Attach, Die Top Attach | ||
Sinter Paste | ALPHA Argomax 2040 Paste | Print, Dot Dispense | Print, Dot Dispense | Die Attach, Die Top Attach |
Engineered Sinter Product | ALPHA Argomax 6100 Laminated Clip | Pick & Place | Pick & Place | Die Top Attach |
Engineered Sinter Product | ALPHA Argomax 6500 Bond Pad | Pick & Place | Pick & Place | Die Top Attach |
Engineered Sinter Product | ALPHA Argomax 9500 Preforms | Pick & Place | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |