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Product Overview
ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types, especially bottom terminated components.
ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
Product Features
- Ultra-Low voiding performance
- Excellent electromigration characteristics
- Good coalescence and wetting performance
- Excellent solder joint and flux residue cosmetics
- Zero-halogen, No halogens intentionally added
Ultra-Low Voiding Performance
Increases process stability, thermal, and electrical performance of the most demanding component applications.
Excellent Electromigration characteristics on large BTC
Passes IPC J-STD-004C IPC-TM-650 at 200 μm to ensure electrical reliability & functionality of fine-pitched components.
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