Thermal Interface Materials

Electrolube® Thermally Conductive Gap Filling pads range from 1.5W/m-K up to 8.5W/m-K thermal conductivity. These pads efficiently conduct heat away from your precious devices, thus ensuring a longer working lifetime and reduced risk of failure. 

The pads are available in both silicone and non-silicone formulations. 

With a thickness range of 0.5 up to 5mm (20 to 200 mil) and a soft, conformable structure, these pads are an ideal solution for creating an excellent thermal path.

Electrolube® Thin Dielectric Sheets provide an efficient thermal path when smaller gaps need to be filled and electrical isolation must be maintained. The materials have a reinforcement carrier to ensure easy handling, and when choosing a Polyimide reinforcement, an extended breakdown voltage can be achieved. Additionally, the material can also be provided with a strong adhesive on both sides, making the use of additional mechanical fasteners unnecessary.

Electrolube® Thermal Pastes are one-component materials that do not require mixing or curing. These pastes create a highly efficient interface between the two mating surfaces thanks to their excellent wet-out properties. Combined with a fairly thin bond line thickness, these pastes offer very low thermal impedance, making them extremely suitable for high-power applications.

Electrolube® Pre-Cured Gels are one-part, form-in-place materials that do not require mixing or post-curing. Gels are more thixotropic than thermal pastes, enabling thicker bond lines and ensuring high vertical gap stability. Pre-Cured Gels can be manually dispensed or applied using automated systems.